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Heating with hydrogen – Innovative condensing technology for a climate-neutral future

Written on {{ “2021-03-12T00:00:00+00:00” | date “longDate” }} Modified on {{ “2021-03-12T00:00:00+00:00” | date “longDate” }} The heating sector and hydrogen are destined to be togetherThese days, up to 20 percent hydrogen can be added to natural gas, significantly reducing CO2 emissionsViessmann is developing a complete portfolio of products to use hydrogen. The innovative “H2ready” condensing boilers […]

Google names Intel veteran Uri Frank in push for more highly integrated cloud chips

Frank will development of silicon for infrastructure, specifically, integrating more functions onto a single chip, so-called systems-on-a-chip, or SoCs.  Google’s Google Cloud unit this afternoon announced that it has appointed twenty-year Intel design veteran Uri Frank to head up its development of new cloud computing chips.  Describing a “doubling-down” on the improvement of computer systems, […]

Mitsubishi Electric to Launch 80×60 pixel Thermal Diode Infrared Sensor

Written on {{ “2021-03-12T00:00:00+00:00” | date “longDate” }} Modified on {{ “2021-03-12T00:00:00+00:00” | date “longDate” }} Identifies heat-source types and human behavior in wide areas and with high precision. New MelDIR thermal diode infrared sensor (80×60 pixels) Mitsubishi Electric Corporation announced today that its Mitsubishi Electric Diode InfraRed (MelDIR) sensor lineup will introduce on July 1 a […]

Residents trained to install 1 MW of solar across NYC Housing Authority developments

Twelve newly trained solar installers are placing panels on New York City Housing Authority developments to provide clean power at discounted rates for low- and moderate-income subscribers. Workers installing solar panels at Carver Houses, a New York City Housing Authority development in northern Manhattan. Accord Power Inc. These workers, who are NYCHA residents from across […]

TOSHIBA’S ANNOUNCES FIVE 650V SUPERJUNCTION POWER MOSFETS HOUSED IN THE NEW TOLL PACKAGE

Toshiba Electronics Europe GmbH (“Toshiba”) has announced five 650V super junction power MOSFETs housed in the new compact SMD package in TO-leadless (TOLL) format. Measuring just 9.9mm x11.68mm x2.3mm (WxLxH), the TK065U65Z, TK090U65Z, TK110U65Z, TK155U65Z, and TK190U65Z devices have a 27% smaller footprint than the conventional D2PAK package. Typical applications include server power supplies in […]